Call for Papers – Hot-Topic Papers

The IEEE European Test Symposium (ETS) is Europe’s premier forum dedicated to presenting and discussing scientific results, emerging ideas, hot topics, and new trends, industrial case-studies and applications, in the area of electronic-based circuits and system testing, reliability, safety, security and validation. The 2021 edition of ETS will be a virtual one. The organizing team will strive to keep the spirit of ETS alive, by organizing an event with live sessions and many opportunities for networking and peer interaction. ETS’21 is organized jointly by KU Leuven and imec, which co-sponsor the event together with the IEEE Council on Electronic Design Automation (CEDA).

The program includes keynotes, scientific paper presentations, panels, tutorials, workshops and highlights/demos from industry.

Besides regular technical papers, ETS’21 provides the opportunity of submitting scientific contributions for Hot-Topic papers presenting early innovative ideas with incomplete results, emerging and future test/reliability/safety problems, or identifying open problems that merit innovative future research. Papers submitted under this category should be of maximum 4 pages in the IEEE 2-column format.

You are invited to participate and submit your contributions to ETS’21. The areas of interest include (but are not limited to) the following topics:

Analog, Mixed-Signal and RF TestHigh-Speed I/0 Test
Approximate Circuit TestingLow-Power Test
ATE Hardware and SoftwareMachine Learning and AI for Test
Automatic Test GenerationMemory Test and Repair
Automotive and Avionics TestMicrosystems / MEMS / Sensors Test
Board Test and DiagnosisOn-Line Test
Built-In Self-TestPower- / Thermal-Aware Test
Current-Based TestProcessor Test (Multi-Core, GPU, CPU, Neuromorphic etc.)
Defect-Based TestSecurity Issues in Test
Delay and Performance TestSelf-X (Awareness, Repair, Test, etc.)
Dependability and Functional SafetySignal Integrity Test
Design for TestSoC and NoC Test
DfX (Design for Manufacturing, Reliability, Yield, etc.)Stacked or 3D ICs Test
Diagnosis and Silicon DebugStandards in Test
Economics of TestTest of Reconfigurable Systems (FPGA, CPLD, etc.)
Failure AnalysisTest, Reliability and Security of Emerging Technologies
Fault Modeling and SimulationTest, Reliability and Security of Emerging Computing (Neuromorphic, In-Memory, Reversible and Quantum Circuits, etc.)
Fault ToleranceTrojan Detection
Hardware SecurityVerification and Validation
Hardware TrustYield Analysis and Enhancement

Publications

ETS’21 will produce Formal Proceedings of scientific papers with ISBN number that will be included in the IEEE Xplore Digital Library. All accepted Hot-Topic papers will be included in the formal Proceedings, labeled as such.

Key Dates for Submissions

Submission deadline for Hot-Topic papers: December 17th, 2020

Notification of acceptance: February 12th, 2021

Camera-ready manuscript and author registration: March 15th, 2021

A PDF version of this CfP can be found here.