The IEEE European Test Symposium (ETS) is Europe’s premier forum dedicated to presenting and discussing scientific results, emerging ideas, hot topics and new trends, industrial case-studies and applications, in the area of electronic-based circuits and system testing, reliability, safety, security and validation. The program includes excellent keynotes, scientific papers, panels, tutorials, workshops and highlights from industry. In 2021, ETS will take place in the Crowne Plaza Hotel in Bruges (Belgium). The city is known for its picturesque Old Town with its medieval architecture (UNESCO heritage) and vibrant museums. ETS’21 is organized jointly by KU Leuven and imec, which co-sponsor the event together with the IEEE Council on Electronic Design Automation (CEDA).
In addition to regular technical papers (presenting novel, unpublished, and complete research), ETS’21 provides the opportunity of submitting scientific contributions for hot-topic papers (presenting early novel ideas) or case-study papers (presenting relevant industrial case studies). Evaluation criteria will depend on the submission category. In addition, submissions are solicited for the PhD Forum as well as proposals for special sessions, panels, embedded tutorials and workshops. Before and after the main ETS’21 symposium, the Test Spring School and Fringe Workshops will be organized.
You are invited to participate and submit your contributions to ETS’21. The areas of interest include (but are not limited to) the following topics:
|3D IC and SiP Test||Heterogeneous and Emerging Architectures|
|Analog, Mixed-Signal and RF Test||High-Speed I/0 Test|
|Approximate Circuit Testing||IoT and CPS Dependability|
|ATE Hardware and Software||Low-Power Test|
|Automatic Test Generation||Machine Learning and Test|
|Automotive and Avionics Test||Memory Test and Repair|
|Board Test and Diagnosis||Microsystems / MEMS / Sensors Test|
|Built-In Self-Test||On-line Test|
|Current-Based Test||Power- / Thermal-Aware Test|
|Defect-Based Test||Processor Test (Multi-Core, GPU, CPU, Neuromorphic, etc.)|
|Delay and Performance Test||Security-Test Trade-offs|
|Design for Test||Self-X (Awareness, Repair, Test, etc.)|
|DfX (Design for Manufacturing, Reliability, Yield, etc.)||Signal Integrity Test|
|Diagnosis and Silicon Debug||SoC and NoC Test|
|Economics of Test||Standards in Test|
|Extra-Functional Aspects||Test for Reversible and Quantum Circuits|
|Failure Analysis||Test of Reconfigurable Systems (FPGA, CPLD, etc.)|
|Fault Modeling||Test, Reliability and Security of Emerging Technologies|
|Fault Simulation||Trojan Detection|
|Fault Tolerance||Verification and Validation|
|Functional Safety||Yield Analysis and Enhancement|
ETS’21 will produce Formal Proceedings of scientific papers with ISBN number that will be indexed by the IEEE Xplore Digital Library. All accepted papers submitted in one of the three categories – i.e. regular, hot topic, and case study – will be included in the Formal Proceedings (hot-topic and case-study papers will be labeled as such).
- Scientific papers for the Formal Proceedings:
- Regular Papers, presenting novel and complete research work;
- Hot-Topic Papers, presenting early innovative ideas with incomplete results, emerging and future test/reliability/safety problems, or identifying open problems that merit innovative future research;
- Case-Study Papers, presenting relevant industrial (or industrial collaboration) data that demonstrate a previously published concept, or that can help further research advancements.
- PhD Forum Contributions from students eager to discuss their on-going research.
- Proposals for Panels, Embedded Tutorials, Special Sessions and Fringe Workshops.
- Industrial Presentations and Table-top Demos focusing on new features of test/reliability/safety- related products.
Key Dates for Submissions
Submission deadline for scientific papers: December 17th, 2020
Submission deadline for PhD Forum, panels, embedded tutorials, special sessions and fringe workshops: January 22nd, 2021
Notification of acceptance: February 12th, 2021
Camera-ready manuscript and author registration: March 15th, 2021